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| this is information on a product in full production. october 2013 docid18315 rev 6 1/65 stm8t143 single-channel capacitive sensor for touch and proximity detection datasheet - production data features ? touch and short range proximity detection ? internal samp ling capacitor ? on-chip integrated voltage regulator ? automatic electrode tuning (aet) ? electrode parasitic capa citance compensation (epcc) ? dynamic calibration (dycal?) ? environment control system (ecs) ? user programmable options include: ? configurable output modes ? configurable sensitivity levels ? data streaming mode ? low power management ? operating supply voltage: 3 v to 5.5 v ? supported interface: ? individual key state output ? single wire data interface ? operating temperature: -40 to +85 c ? ecopack? 8-pin so and 8-pin ufdfpn packages applications ? ear-face proximity detection for smart phone devices ? companion device for navigation joystick/optical track pad ? user hand detection for nomad equipment (tablet pc) ? ear-head detection for mp3/walkman ear buds and bluetooth headsets ? on/off touch sensing button such as gps system home button ? user hands detection for mouse/keyboards ? wall switch backlight activation on user approach and light controls on user touch ufdfpn8 (2 x 3 mm) so8 (narrow) www.st.com
contents stm8t143 2/65 docid18315 rev 6 contents 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 stm8t proxsense technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1 capacitive sensing overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 4.2 charge-transfer acquisition principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 4.3 internal sampling capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.4 electrode parasitic capacitance compensation (epcc) . . . . . . . . . . . . . . 13 5 stm8t143 processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1 automatic electrode tuning (aet) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.2 signal calculation and reference calibration . . . . . . . . . . . . . . . . . . . . . . . 15 5.3 detection and release thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.4 dynamic calibration (dycal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.5 environment control system (ecs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.5.1 ecs principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.5.2 ecs halt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.5.3 reference freeze and reference freeze ti meout . . . . . . . . . . . . . . . . . . 23 5.5.4 ecs filter constant adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.6 debounce filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6 device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 6.1 option byte description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 6.2 device operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 6.2.1 dual output mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 6.2.2 control mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 6.2.3 data streaming mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6.3 output polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 6.4 power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 docid18315 rev 6 3/65 stm8t143 contents 4 7 typical application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 8 design guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 8.1 sensitivity adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 8.1.1 pcb layout and construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 9 electrical characteristi cs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.1 parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.1.1 minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.1.2 typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.1.3 typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.1.4 loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.2 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 9.3 operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 9.3.1 general operating conditions and supply characteristics . . . . . . . . . . . 38 9.3.2 average current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 9.3.3 i/o pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 9.4 regulator and reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 9.5 capacitive sensing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 9.6 streaming mode characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 9.7 emc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 9.7.1 functional ems (electromag netic susceptibility) . . . . . . . . . . . . . . . . . . 45 9.7.2 prequalification trials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 9.7.3 electromagnetic interference (emi) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 9.7.4 absolute maximum ratings (electrical sensit ivity) . . . . . . . . . . . . . . . . . 46 9.7.5 electrostatic discharge (esd) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 9.7.6 static latchup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10 package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 10.1 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 10.1.1 so8 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 10.1.2 ufdfpn8 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 10.2 package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 10.2.1 reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 11 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 contents stm8t143 4/65 docid18315 rev 6 11.1 stm8t143 ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . 53 11.2 orderable favorite device lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 11.2.1 part number option bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 11.3 in-factory option byte programming service . . . . . . . . . . . . . . . . . . . . . . . 54 11.4 revision code on device markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 12 stm8t143 programming tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 13 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 docid18315 rev 6 5/65 stm8t143 list of tables 5 list of tables table 1. stm8t143 pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 2. option bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table 3. option byte description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 4. pin 1 configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 table 5. pin 8 configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 table 6. data streaming frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 table 7. voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 table 8. current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 table 9. thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 table 10. operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 table 11. average current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 table 12. out/tout/data streaming pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 table 13. pout/tout pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 table 14. ctrl pin characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 table 15. regulator and reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 table 16. general capacitive sensing characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 table 17. internal c s value. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 table 18. implemented epcc values (pf) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 table 19. external sensing component characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 table 20. data streaming timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 table 21. ems data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 table 22. emi data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 table 23. esd absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 table 24. electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 table 25. so8-lead plastic small outline - package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . 48 table 26. ufdfpn8-lead ultra thin fine pitch dual flat - package mechanical data . . . . . . . . . . . . . . 50 table 27. thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 table 28. option byte values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 table 29. device identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 table 30. ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 table 31. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 list of figures stm8t143 6/65 docid18315 rev 6 list of figures figure 1. stm8t143 block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 2. so8 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 3. ufdfpn8 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 4. coupling with hand increases the capacitance of the sensing electrode . . . . . . . . . . . . . . 11 figure 5. stm8t143 measuring circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 6. signal monitored on c x pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 7. automatic electrode tuning (aet) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 8. signal reference and detection threshold (not detailed) . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 9. dycal general operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 10. dycal operation with water resi due . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 11. no dycal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 12. iir filter formula . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 13. ecs halt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 14. unwanted detection managed by the reference fr eeze timeout . . . . . . . . . . . . . . . . . . . . . 23 figure 15. ecs filter k constant managemen t. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 figure 16. data streaming frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 figure 17. typical application schematic for control mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 figure 18. typical application schematic for dual output mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 figure 19. typical application schematic for data streaming mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 35 figure 20. pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 figure 21. data streaming timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 figure 22. so8-lead plastic small outline - package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 figure 23. so8 narrow recommended footprint (dimensions in mm) . . . . . . . . . . . . . . . . . . . . . . . . . 49 figure 24. ufdfpn8-lead ultra thin fi ne pitch dual flat package (mlp) package outline . . . . . . . . . . 50 figure 25. ufdfpn 2 x 3 mm recommended footprint (dimen sions in mm) . . . . . . . . . . . . . . . . . . . . 51 figure 26. stm8t143 ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 figure 27. so8 package ma rking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 figure 28. ufdfpn8 package marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 figure 29. stm8t143 programming tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 docid18315 rev 6 7/65 stm8t143 description 64 1 description the stm8t143 is a single channel, fully integrated, touch sensing capacitive sensor. it uses a proxsense? charge transfer capacitive acquisi tion method that is capable of near range proximity detection. the stm8t143 offers a state of the art capacitive sensing engine with an embedded sampling capacitor and voltage regulator allowing the overall solution cost to be reduced and improving system immunity in noisy environments. it can target a detection range up to 20 cm thanks to the electrode parasitic capacitance compensation (epcc) feature. the epcc automatically compensates ground parasitic capacitance sources (such as ground planes, printed circuit board tacks, and large metal objects) which significantly reduce the proximity detection range. the application fields or typical functions wit h proximity features are various and include: on/off switches, replacement/enhancement, home buttons, backlighting feature on proximity for user interfaces, wakeup or control function on proximity, find-in-the-dark for lighting equipment, and companion device for battery saving in portable equipment. the device has been designed to be used in applications where proximity is required and touch conditions can prevail for an extended period of time which may result in uncompensated drift in conventional capaci tive sensors. theref ore, a process called dycal is implemented. the stm8t143 is an ideal alternative, cost-effective, and extremely low power solution to replace conventional infrared optical proximity sensors. capacitive sensing technology is not sensitive to sunlight or artificial light effects. the stm8t143 offers a much lower consumption (12 a range versus 100 a range) and a small form factor (dfn8 2*3*0.65 mm). lastly, there is no need for a clear opening on the bezel to let light pass through. the stm8t143 is offered in 8-pin packages and features both touch and proximity sensing outputs. the stm8t143 touch pad can sense through almost any dielectric and thereby allows the electronics to be contained in a sealed enclosure. note: proxsense? is a trademark of azoteq (pty) ltd. block diagram stm8t143 8/65 docid18315 rev 6 2 block diagram figure 1. stm8t143 block diagram rc oscillator the 1-mhz rc oscillator is an internal fixed fr equency oscillator used to supply the clock to the mcu system engine. voltage regulator the voltage regulator has an internal comparison and feedback circuit that ensures the v reg voltage is kept stable and constant. the regulator requires an external smoothing capacitor. mcu system engine the mcu system engine controls the capacitive sensing engine and processes touch and proximity detection signals. advanced proxsense engine the advanced proxsense engine circuitry uses a charge-transfer method to detect capacitance changes. it features: ? an analog voltage comparator ? a programmable internal sampling capacitor ? a system that allows the grou nd parasitic capacitance to be compensated to improve the system sensitivity. this system is called electrode parasitic capacitance compensation (epcc). d l f & ; & ( 3 & & & 6 & x u u h q w p l u u r u 9 d u l d e o h q h j d w l y h f d s d f l w d q f h 9 7 5 , 3 & r p s d u d w r u 9 5 ( * 9 ' ' 2 8 7 7 2 8 7 ' $ 7 $ & 7 5 / 3 2 8 7 2 s w l r q e \ w h 5 & r v f 0 & 8 v \ v w h p h q j l q h 9 r o w d j h u h j x o d w r u $ q d o r j v z l w f k $ g y d q f h g 3 u r [ 6 h q v h h q j l q h docid18315 rev 6 9/65 stm8t143 pin descriptions 64 3 pin descriptions figure 2. so8 pinout figure 3. ufdfpn8 pinout 1. control mode 2. dual output mode 3. data streaming mode d l h 2 8 7 7 2 8 7 ' $ 7 $ 9 6 6 1 & & ; & 7 5 / 3 2 8 7 9 5 ( * 1 & 9 ' ' d l h 2 8 7 7 2 8 7 ' $ 7 $ 9 6 6 1 & & ; & 7 5 / 3 2 8 7 9 5 ( * 1 & 9 ' ' pin descriptions stm8t143 10/65 docid18315 rev 6 table 1. stm8t143 pin descriptions pin no. mode pin type (1) 1. s: power supply, sns: capacitive sensing, od : output open drain, pp: output push-pull, and i: input pin name pin function (2) 2. pin function depends on option byte configuration (please refer to section 6: device operation ) 1 control mode od/pp out touch or proximity output dual output mode od/pp tout touch output data streaming mode od data data streaming output 2- sv ss ground 3 - - nc not connected 4- snsc x capacitive sensing channel pin to r x 5- sv dd supply voltage 6 - - nc not connected 7- sv reg internal voltage regulator output (3) 3. requires a low equivalent series resistance (esr), 1 f capacitor to ground. this output must not be used to power other devices. 8 control mode i ctrl control input dual output mode pp pout proximity output docid18315 rev 6 11/65 stm8t143 stm8t proxsense technology 64 4 stm8t proxsense technology 4.1 capacitive sensing overview a capacitance exists between any reference point and ground as long as they are electrically isolated. if this reference point is a sensing electrode, it can help to think of it as a capacitor. the positive electrode of the capacitor is the sensing electrode, and the negative electrode is formed by the surrounding area (virtual ground reference in figure 4 ). figure 4. coupling with hand increases the capacitance of the sensing electrode when a conductive object is brought into proximity of the sensing electrode, coupling appears between them, and the capacitance of the sensing electrode relative to ground increases. for example, a human hand raises the capacitance of the sensing electrode as it approaches it. touching the dielectric pane l that protects the electrode increases its capacitance significantly. 4.2 charge-transfer ac quisition principle to measure changes in the electrode capaci tance, stm8t devices employ bursts of charge-transfer cycles. the measuring circuitry is connected to the c x pin. it is composed of a serial resistor r x plus the sensing electrode itself of equivalent capacitance c x (see figure 5 ). the sensing electrode can be made of any electrically condu ctive material, such as copper on pcbs, or transparent conductive material like indium tin oxide (ito) deposited on glass or plexiglas. the dielectric panel usually pr ovides a high degree of isol ation to prevent electrostatic discharge (esd) from reaching the stm8t touc h sensing controller. connecting the serial resistor (r x ) to the c x pin improves esd immunity even more. c t lower capacitance c x higher capacitance sensing electrode stm8t proxsense technology stm8t143 12/65 docid18315 rev 6 figure 5. stm8t143 measuring circuitry 1. r x must be placed as close as possible to the device. the principle of charge transfer is to charge the electrode capacitance (c x ) using a stable power supply. when c x is fully charged, part of the accu mulated charge is transferred from c x to an internal sampling capacitance, referred to as c s . the transfer cycle is repeated until the voltage across the sampling capacitor c s reaches the end of acquisition reference voltage (v trip ). the change in the electrode capaci tance, caused by the presence or absence of the human body, is detected by measuring the number of transfer cycles composing a burst (see figure 6 ). throughout this document the following naming conventions apply: ? the charge transfer period ( t transfer ) refers to the charging of c x and the subsequent transfer of the charge to c s . ? the burst cycle duration (t burst ) is the time required to charge c s to v trip . the burst count is the number of charge transfer periods (t transfer ) during one t burst cycle. ? the sampling period (t sampling ) is the acquisition rate. figure 6. signal monitored on c x pin d l f & ; & ; a s ) & 7 a s ) ' h y l f h 6 h u l d o u h v l v w r u 5 ; ; ( d u w k w w 6 $ 0 3 / , 1 * & ; $ l w % 8 5 6 7 9 & ; / w 7 5 $ 1 6 ) ( 5 w % 8 5 6 7 7 3 & ( docid18315 rev 6 13/65 stm8t143 stm8t proxsense technology 64 4.3 internal sampling capacitor to reduce the application cost and increase the device flexib ility, the stm8t143 features several internal sampling capacitors to fit a wide range of applications. 4.4 electrode parasitic cap acitance compensation (epcc) the implementation of an electrode pad in a system always induces parasitic capacitances through tracks and surrounding components.the electrode parasitic capacitance is the residual capacitance between electrode and ground when no finger is present. the epcc is an internal hardware circuitry that compensates part of the electrode parasitic capacitance to improve the capaci tive sensing channel sensitivity. stm8t143 processing stm8t143 14/65 docid18315 rev 6 5 stm8t143 processing the stm8t143 device is designed to ensure reliable operation whatever the environment and operating conditions. to achieve this high level of robustness, dedicated processing have been implemented: ? automatic electrode tuning (aet) ? signal and reference calibration ? detection and release thresholds ? dynamic calibration (dycal) ? environment control system (ecs) ? debounce filter ? host control input 5.1 automatic electro de tuning (aet) aet is a sophisticated technology implemented in the stm8t143 device. it optimizes the performance of the device in a wide range of applications and environmental conditions. aet algorithm automatically adjusts the internal c s capacitor and epcc parameters to optimize system performance. please refer to: ? table 17: internal cs value for possible resulting values of this internal sampling capacitance ? table 18: implemented epcc values (pf) for possible values of the epcc capacitance. the principle is to select an internal c s capacitor and epcc to obtain a burst count in a predefined range of aet target value 256 burst counts. at device startup, c s is selected to reach the nearest signal burst count value to a ?gain target value?. then, the epcc hardware subt racts an increasing capacitance value until a ?aet target value? is reached. during normal device operation, the epcc hardware subtracts from the electrode capacitance (c x ), the compensation capacitance value determined during the calibration phase. this automatic system adaptation allows the same burst count number to be reached regardless of the application electrode and surrounding. the aet gain can be adjusted by selecting the ga in target value through the ?gain target? option bits. the aet algorithm is executed whenever the de vice starts-up and during device operation when the reference exits burst count range. during the aet processing (t aet ), proximity and touch events cannot be detected (please refer to table 6: data streaming frame ). in data streaming m ode, the aet activity is reported and the internal c s and epcc values can be monitored (see section 6.2.3: data streaming mode ). docid18315 rev 6 15/65 stm8t143 stm8t143 processing 64 figure 7. automatic electrode tuning (aet) 1. for the aet and gain target values, please refer to table 16: general capacitiv e sensing characteristics . 5.2 signal calculation and reference calibration the capacitance change, induced by the presence of a finger or a hand in the device detection area, is sensed by the variation in the number of charge transfer pulses composing the burst. the number of charge transfer pulses is called ?burst count?. the burst count is filtered against the noise and compared to a ?reference? to determine if there is a touch/proximity detection. please refer to section 5.5: environment control system (ecs) for more details about the filtering process. the reference is calculated at device startup during the calibration phase by averaging the first 44 measurements before normal device operation. then, the environment control system takes care of the reference slow evolution over time. d l e 5 h i h u h q f h e x u v w f r x q w w $ ( 7 7 k h q w k h ( 3 & & y d o x h l v v h o h f w h g w k u r x j k d g l f k r w r p \ d o j r u l w k p x q w l o w k h e x u v w f r x q w u h d f k h v w k h $ ( 7 w d u j h w y d o x h ) l u v w w k h & 6 y d o x h l v l q f u h d v h g x q w l o w k h e x u v w f r x q w u h d f k h v w k h j d l q w d u j h w y d o x h v h o h f w h g e \ r s w l r q e \ w h v * d l q e l w v & ( 3 & & v h o h f w l r q e l w v & 6 v h o h f w l r q & ( 3 & & v h w w r stm8t143 processing stm8t143 16/65 docid18315 rev 6 5.3 detection and release thresholds during the detection operation, after calibration is over, the stm8t143 switches between three operating states: no detection , proximity detection , and touch detection . the switch between these states is driven by the difference between the signal and the reference. the system goes from no detection to proximity detection state when the (reference - signal) is higher than the proximity threshold (pth). in this state, the ecs is halted and the reference is frozen. the system goes from no detection or proximity detection state to touch detection state when the (reference - signal) is higher than the touch threshold (tth). when this happens, the reference value is changed to reflect the touch state after the delay t dycal . this process is called dynamic calibration (dycal). the system goes from the touch detection to no detection state when the (signal - reference) goes above the release threshold (rth). at this point, another dycal occurs for the reference to represent the untouched state again. for higher flexibility, several proximity and touch detection threshol ds are available and independently selectable through option byte: one pth and one tth. ? the touch thresholds allow the touch sensitiv ity to be adapted to the panel thickness and the electrode sensitivity. ? the proximity thresholds allow the stm8t143 device to adapt to various surroundings and to tune the detection distance. the release threshold is a ratio of the touch threshold noted (tth). tth is selected by the ?touch detection threshold? option bits. the ratio is selected by the ?release threshold ratio? option bits. a time filtering, similar to the debouncing of the mechanical switch es, is applied to avoid noise induced detections. please refer to section 5.6: debounce filter for operation details. figure 8 simplifies the proximity and touch detecti on event according to the signal variation ? (signal)?. the (signal) is the absolute value of the reference minus the signal. docid18315 rev 6 17/65 stm8t143 stm8t143 processing 64 figure 8. signal reference and detection threshold (not detailed) 1. t aet_halt = aet halt period after end of detection. d l 5 h i h u h q f h 3 7 k 7 7 k 6 l j q d o 5 7 k ' h w h f w l r q 3 u r [ l p l w \ 7 r x f k w ' < & $ / w $ ( 7 b + $ / 7 v l j q d o 5 h i 6 l j q d o 3 7 k v l j q d o 3 7 k v l j q d o 7 7 k v l j q d o 7 7 k v l j q d o 5 7 k 5 7 k v l j q d o ' ' ' ' ' ' ' h w h f w l r q stm8t143 processing stm8t143 18/65 docid18315 rev 6 5.4 dynamic calibration (dycal) the stm8t143 dycal process is based on a dynamic threshold and reference management which allows tracking of slow env ironmental changes even when the sensor is in touch state. a low threshold is used to detect the proximity of an object, with a higher threshold for touch detection. dycal is perf ormed when a touch condition is detected for longer than a certain period (t dycal ). when a release condition occurs, the dycal operation is performed instantaneously. figure 9 represents the dycal operation for the touch event (dycal_t) and for the release event (dycal_r). after the dycal_r event, the aet process is frozen for a t aet_halt delay. figure 9. dycal general operation 1. t aet_halt = aet halt period after end of detection. 2. the release threshold (rth) is a ratio of the touch th reshold (tth). tth is selected by the ?touch detection threshold? option bits (tth). the ratio is sele cted by the ?release thres hold ratio? option bits. 3. t f th = touch freeze threshold. please refer to table 16: general capacitiv e sensing characteristics and figure 12: iir filter formula for the t f th description. 4. in touch condition, the ecs allows the refe rence to adapt a slow signal variation change. 5 h i h u h q f h ' < & $ / b 7 3 7 k 7 7 k 6 l j q d o 7 ) 7 k 5 7 k ' h w h f w l r q 3 u r [ l p l w \ r x w s x w 7 r x f k r x w s x w w ' < & $ / w $ ( 7 b + $ / 7 d l f ' < & $ / b 5 ' h w h f w l r q docid18315 rev 6 19/65 stm8t143 stm8t143 processing 64 figure 10 is an example of how the system behaves with a water residue when it is managed by dycal. figure 10. dycal operation with water residue 1. t aet_halt = aet halt period after end of detection. 2. t f th = touch freeze threshold. please refer to table 16: general capacitiv e sensing characteristics and figure 12: iir filter formula for the t f th description. 6 l j q d o ' < & $ / b 7 ' < & $ / b 5 w $ ( 7 b + $ / 7 3 7 k 7 7 k 7 ) 7 k 7 7 k 3 7 k 5 7 k d l f ' h w h f w l r q ' h w h f w l r q w ' < & $ / 5 h i h u h q f h 3 u r [ l p l w \ r x w s x w 7 r x f k r x w s x w stm8t143 processing stm8t143 20/65 docid18315 rev 6 figure 11 is an example of how the system behaves with a water residue if the system is not managed by dycal. figure 11. no dycal d l 3 u r [ l p l w \ g h w h f w l r q l v o r f n h g 2 1 3 u r [ l p l w \ r x w s x w 7 r x f k r x w s x w 3 7 k 5 h i h u h q f h 6 l j q d o 7 7 k ' h w h f w l r q docid18315 rev 6 21/65 stm8t143 stm8t143 processing 64 5.5 environment control system (ecs) 5.5.1 ecs principle the acquired signal value of the capacitive sensing channel increases or decreases according to environmental conditions such as temperature, power supply, moisture, and surrounding conductive objects. the stm8t143 includes a built-in digital infinite impulse response (iir) filter capable of tracking slow changes in the environment. it is called the environment control system (ecs). this is a low pass filter with a gain of one. the filter makes the reference follow slow changes of the signal while fast changes are recognized as a touch or proximity. figure 12. iir filter formula note: if a touch or proximity is detected, the ecs is disabled for the duration of the reference freeze timeout. in this case, y n = y n_1 . as soon as the reference freeze times out or the detection ends, the filter is set as active again. < q . < q . ; q 6 l j q d o ' h o w d 5 h i h u h q f h < q ; q d l stm8t143 processing stm8t143 22/65 docid18315 rev 6 5.5.2 ecs halt as soon as a proximity detection is triggere d, the ecs should be halted otherwise the ecs considers the signal variation due to the user action as an environment change. in such a case, the ecs adapts to the new conditions until the reference reaches the current signal level generated by the user. this leads to a detection loss as described in figure 13 . figure 13. ecs halt note: 1 the dashed lines in figure 13 represent the reference and thresholds if ecs is not halted. in this case, detection is lost before the user exits the electrode detection area. the plain lines represent normal device processing with the ecs stop. 5 h i h u h q f h 2 x w s x w 3 7 k 6 l j q d o 7 7 k ' h w h f w l r q 1 r g h w h f w l r q 3 u r [ h y h q w ' h w h f w l r q o r v w d l 3 7 k docid18315 rev 6 23/65 stm8t143 stm8t143 processing 64 5.5.3 reference freeze and reference freeze timeout to prevent an object under detection from infl uencing the reference value, the ecs is halted as soon as a proximity detection happens: pth < (signal) < tth. consequently, the reference is frozen. in order to recover from a sudden environment change, the reference freeze ends after a maximum programmable delay called the ?reference freeze timeout? (t rft ). when a detection lasts longer than the t rft , a recalibration process occurs. the recalibration consists of setting the reference to the current burst count value minus 8. then, ecs is re- enabled and the reference moves along the signal. after a period of time that depends on the signal variation speed, the difference be tween the signal and the reference becomes smaller than the detection threshold and the device reports no detection. the process delay after the timeout, to get the reference aligned with the current signal, is called the recalibration time (t recal ). figure 14 describes the situation where an unwant ed detection is solv ed by the reference freeze timeout. the left-hand side of the im age (reference freeze timeout enabled) shows the reference freeze timeout configured to launch a calibration if water droplets are poured onto the electrode. the droplet capacitance is not sufficient to make the device enter into touch detection but it is enough to trigger a proximity detection. if the proximity detection caused by the droplets lasts longer than the reference freeze timeout delay, the device recalibrates to the new ?wet? environment. cons equently, the detection output is cleared. the right-hand side of the image (infinite reference freeze timeout) shows the device behavior when the reference freeze timeout is disabled. the device leaves proximity detection only after the droplets are removed. figure 14. unwanted detection managed by the reference freeze timeout 5 h i h u h q f h i u h h ] h w l p h r x w h q d e o h g , q i l q l w h u h i h u h q f h i u h h ] h w l p h r x w 3 7 k 5 h f d o l e u d w l r q h y h q w 7 7 k , q i l q l w h u h i h u h q f h i u h h ] h 6 l j q d o 5 h i h u h q f h 2 x w s x w 2 x w s x w 6 l j q d o 7 7 k 7 7 k 7 7 k 5 h i h u h q f h 5 h i h u h q f h i u h h ] h w l p h r x w g h o d \ d l ' h w h f w l r q w l p h r x w 3 7 k 3 7 k 3 7 k ' h w h f w l r q stm8t143 processing stm8t143 24/65 docid18315 rev 6 5.5.4 ecs filter constant adjustment to track the environmental changes more accurately and to manage the detection occurrence more efficiently, different ecs filter k co-efficient values are set according to the signal range and detection state. figure 15: ecs filter k constant management provides the filter k co-efficient valu e in different situations. figure 15. ecs filter k constant management ? ? 5 h i h u h q f h ' < & $ / b 7 3 7 k 7 7 k 6 l j q d o ' < & $ / b 5 7 ) 7 k 5 7 k 5 ) 7 k 5 ) 7 k ' h y l f h v w d w h 1 r g h w h f w l r q 3 u r [ g h w h f w l r q 7 r x f k g h w h f w l r q 1 r g h w h f w l r q 6 l j q d o u d q j h v l j q d o 5 h i 6 l j q d o v l j q d o ' 5 ) 7 k v l j q d o ' 6 l j q d o 5 h i 6 l j q d o 7 ) 7 k 5 h i 6 l j q d o 5 7 k 5 h i 7 ) 7 k v l j q d o ' 5 ) 7 k v l j q d o ' 5 ) 7 k ( & ) f r q v w d q w . f . f 5 h i h u h q f h $ g d s w l q j v o r z o \ $ g d s w l q j t x l f n o \ ) u r ] h q $ g d s w l q j t x l f n o \ ) u r ] h q $ g d s w l q j t x l f n o \ $ g d s w l q j v o r z o \ $ g d s w l q j v o r z o \ y h u \ d l . . . . . . 3 u r [ g h w h f w l r q docid18315 rev 6 25/65 stm8t143 stm8t143 processing 64 5.6 debounce filter the purpose of the debounce filter mechanism is to reduce the effects of noise on the touch and proximity detection. debouncing is applied to acquisition samples to filter undesired abrupt changes. the principle is to wait for several consecutive acquisitions with the signal on the same side of a threshold before reporting the change in detection state induced by this threshold crossing . the number of consecutive detection debounce counts ( ddc) and end of detection debounce counts (eddc) needed to identify a proximity/touch detection are defined in section 9.5: capacitive sens ing characteristics on page 42 . device operation stm8t143 26/65 docid18315 rev 6 6 device operation the stm8t143 can be configured through a set of user-selectable one-time programmable (otp) option bytes. these options can be used in their default (unconfigured) state or set for specific applications. for large orders, preconfigured devic es are available (please refer to section 11: order ing information ). the available options include: ? dual output, control, or data streaming mode ? output polarity ? touch and proximity detection thresholds ? eight selectable detection thresholds for touch detection ? four selectable detection thresholds for proximity detection ? control type ? halt conversion control ? reference freeze control ? reference freeze timeout 6.1 option byte description a set of tools is supplied by stmicroelectronics to program the user otp options for prototyping purposes. please refer to section 12: stm8t143 programming tool for more details. note: devices which are not yet programmed (also called blank devices) are delivered with all bits set to ?0?. table 2. option bytes option byte no. option bits factory default setting bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 opt2 reserved output type (1) release threshold ratio gain target reserved 0x00 opt1 data streaming mode low power mode reference freeze timeout dynamic calibration delay reserved dual output/ control mode 0x00 opt0 touch detection threshold proximity detection threshold reserved output polarity control type 0x00 1. used only in control mode. docid18315 rev 6 27/65 stm8t143 device operation 64 table 3. option byte description option byte no. description opt2 bits [7:6] : reserved, must be cleared bit 5: output type in control mode (see section 6.2.2: control mode ) 0: proximity output 1: touch output bit 4: release threshold ratio 0: 75 % 1: 87.5 % bits [3:1] : gain target 000: 200 001: 250 010: 300 011: 350 100: 400 101: 550 110: 700 111: 850 bit 0 : reserved, must be cleared opt1 bit 7 : data streaming mode (see section 6.2.3: data streaming mode ) 0: disabled 1: enabled bits [6:5] : low power mode (see section 6.4: power modes ) 00: normal power mode 01: low power mode 1 10: low power mode 2 11: low power mode 3 bits [4:3]: reference freeze timeout t rft (see section 5.6: debounce filter ) 00: infinite 01: 18 s 10: 60 s 11: 3 s bit 2: dynamic calibration delay (t dycal) 0: 250 ms 1: 1 s bit 1 : reserved, must be cleared bit 0: dual output/control mode (see section 6.2.1: dual output mode ) 0: pin 8 in control input mode 1: pin 8 in proximity output mode device operation stm8t143 28/65 docid18315 rev 6 opt0 bits [7:5] : touch detection threshold (tth) 000: 40 001: 60 010: 100 011: 200 100: 360 101: 500 110: 700 111: 900 bit [4:3] : proximity detection threshold ( pth ) 00: 4 01: 8 10: 16 11: 32 bit 2 : reserved, must be cleared bit 1 : output polarity (see section 6.3: output polarity ) (1) 0: active low 1: active high bit 0 : control type (see section 6.2.2: control mode ) 0: halt conversion control 1: reference freeze control 1. effective only when data streaming mode is disabled table 3. option byte description (continued) option byte no. description docid18315 rev 6 29/65 stm8t143 device operation 64 6.2 device operating modes the stm8t143 device provides three operating modes: ? dual output mode ? control mode ? data streaming mode these modes are selected through the option bytes. 6.2.1 dual output mode the device is configured by default in control mode. the dual output/control mode bit allows the user to configure pin 8 of the device in control input or proximity output. when dual output mode is selected, pin 8 bec omes the proximity output while pin1 is the touch output. table 4. pin 1 configuration pin 1 configuration data streaming mode dual output/control mode output type output polarity opt1 bit 7 opt1 bit 0 opt2 bit 5 opt0 bit 1 data pin open drain output 1xxx proximity output open drain output, active low 0000 proximity output push-pull output, active high 0001 touch output open drain output, active low 0010 touch output push-pull output, active high 0011 proximity output open drain output, active low 01x0 proximity output push-pull output, active high 01x1 table 5. pin 8 configuration pin 8 configuration dual output/control mode control type output polarity opt1 bit 0 opt0 bit 0 opt0 bit 1 halt control input 0 0 x ecs control input 0 1 x proximity output push-pull output, active low 1x0 touch output push-pull output, active high 1x1 device operation stm8t143 30/65 docid18315 rev 6 6.2.2 control mode in control mode, pin 8 can be used to halt the conversion or to freeze the reference (refer to section 5.4: dynamic calibration (dycal) ). halt conversion control mode when the conversion is halted, the device is in low power consumption state (see device electrical characteristics). in this state, the ctrl pin can be used to manage the power consumption and/or control the acquisition to synchronize the sampling burst with external events. this can be useful, for example, to hal t acquisitions during noisy operations or to synchronize an acquisition with the noise period. when the ctrl pin is tied high for longer than t ctrl , the charge conversion cycle is halted, once the current conversion has been completed. the device remains in this halt mode until the ctrl line is tied low again. an automatic recalibration is performed directly after the ctrl pin is released to compensate for any environmental changes which might have occurred during the halt duration. reference freeze control mode in this mode, the device reference evolution can be frozen according to the ctrl pin state. the ctrl pin has precedence over the configur ation bits selected for the reference freeze timeout. this function can be used to implement user-dedicated ecs management. when the ctrl pin is tied high for longer than t ctrl , the filter is halted until this pin is tied low. if the host freezes the reference at device star tup, the calibration starts after the reference freeze is released. forced recalibration generating a pulse of t recal_control duration on the ctrl pin recalibrates the reference. the ecs is reset, clearing the output state. please refer to table 16: general capacitive sensing characteristics for t recal_control constraints. if the signal value is outside its allowable range, the device forces an aet process event. (refer to section 5.1: automatic el ectrode tuning (aet) ) docid18315 rev 6 31/65 stm8t143 device operation 64 6.2.3 data streaming mode the stm8t143 can stream data to allow designers fine tune the application and device settings. data streaming may also be used by an mcu to control events or to further process the results obtained from stm8t143 devices. data streaming is performed using a 1-wire communication data protocol on the data streaming output pin. when data streaming mode is enabled, the out function is no longer accessible. data streaming protocol the data streaming output is open drain. figure 16 illustrates the communication protocol for initializing and sending data using a 1-wire communication protocol. 1. communications is initiated by a start bit. 2. following the start bit, a synchronization by te (0xaa) is sent. this byte can be used by the mcu for clock synchronization. 3. following the synchronization byte, the data bytes are sent with the msb first. 4. each byte sent is preceded by a start bit; a stop bit follows every byte. 5. the stop bit does not have a defined period. figure 16. data streaming frame data streaming is initiated by the stm8t143. when data streaming is enabled, a frame is sent after each charge cycle. therefore, the acquisition is not disturbed by the communication itself. % \ w h % \ w h ' $ 7 $ 6 w r s 6 w d u w 6 w r s 6 w d u w 6 w d u w d l 6 < 1 & e \ w h ' $ 7 $ e \ w h 6 7 2 3 e l w % \ w h % \ w h % \ w h % \ w h % \ w h % \ w h device operation stm8t143 32/65 docid18315 rev 6 frame format the content of the data frame is described in table 6 . 6.3 output polarity the polarity can be chosen to define pout and tout active state during a detection event such as high or low. when the device is configured in output active low, pin 8 is in open drain configuration. when the device is configured in output active high, pin 8 is in push-pull configuration. table 6. data streaming frame byte # bit description 0 [7:0] signal burst count (msb) 1 [15:8] signal burst count (lsb) 2 [23:16] reference burst count (msb) 3 [31:24] reference burst count (lsb) 4 39 38 37 36 35 34 33 32 aet processing proximity event detected touch event detected out state indication reserved reserved reserved reserved 5 47 46 45 44 43 42 41 40 ics bit 2 ics bit 1 ics bit 0 epcc bit 4 epcc bit 3 epcc bit 2 epcc bit 1 epcc bit 0 6 [55:54] 53 52 51 50 49 48 reserved epcc bit 5 touch threshold bit 2 touch threshold bit 1 touch threshold bit 0 proximity threshold bit 1 proximity threshold bit 0 7 [63:56] frame counter docid18315 rev 6 33/65 stm8t143 device operation 64 6.4 power modes the stm8t143 device offers four power modes wh ich are specifically designed for battery applications: ? normal power mode ? low power mode 1 ? low power mode 2 ? low power mode 3 the difference between the four power modes is the t sampling time (see table 16: general capacitive sensin g characteristics ). by selecting low powe r modes, extra delays are interlaced between bursts resulting in a longer t sampling period. this improves the device current consumption at the expense of a longer response time. typical application diagram stm8t143 34/65 docid18315 rev 6 7 typical application diagram figure 17. typical application schematic for control mode 1. r x is optional for added esd protection 2. active low open drain output pi n or push-pull active high 3. keep track as short as possible 4. c vdd is optional for added ic stability 5. please refer to table 8: current characteristics for the maximum output load drive current capability figure 18. typical application sc hematic for dual output mode 1. r x is optional for added esd protection 2. active low open drain output pi n or push-pull active high. 3. keep track as short as possible 4. c vdd is optional for added ic stability 5. please refer to table 8: current characteristics for the maximum output load drive current capability d z > s ^ ^ k h d y s s z ' ^ v? o ??} d z > ]v?? s ~e k??? s z y ~ s l}zu ~? ]??? ~? s z ' ~? r &u v &u ? & ~? ^??o? ]v?? 9 6 6 & ; 9 ' ' 9 5 ( * 6 h q v h h o h f w u r g h & 9 ' ' 9 ' ' 5 ; 9 ' ' n r k p d l f & 9 5 ( * 3 2 8 7 7 2 8 7 3 2 8 7 7 2 8 7 ? ) q ) s ) 6 x s s o \ l q s x w docid18315 rev 6 35/65 stm8t143 typical application diagram 64 figure 19. typical application schematic for data streaming mode 1. r x is optional for added esd protection 2. open drain output pin 3. keep track as short as possible 4. c vdd is optional for added ic stability 5. please refer to table 8: current characteristics for the maximum output load drive current capability 9 6 6 & ; 9 ' ' 9 5 ( * 6 h q v h h o h f w u r g h & 7 5 / l q s x w & 9 ' ' 9 ' ' 5 ; d l f & 9 5 ( * & 7 5 / ' $ 7 $ ' $ 7 $ v w u h d p l q j r x w s x w 9 ' ' n r k p ? ) q ) s ) 6 x s s o \ l q s x w design guidelines stm8t143 36/65 docid18315 rev 6 8 design guidelines 8.1 sensitivity adjustment several factors impact device sensitivity: ? the sensing electrode material and size ? the touch panel material and thickness ? the board layout and in particular the sensing signal tracks ? the ground coupling of the object (finger or hand) and sensor ? the touch or proximity detection threshold selected 8.1.1 pcb layout and construction the pcb traces, wiring, and components associated or in contact with c x pins become touch sensitive and should be treated with c aution to limit the touch area to the desired location. even with aet it is important to limit th e amount of stray capacitance on the c x pin. this can be done by minimizing trace le ngths and widths. to minimize cross-coupling, tracks from adjacent sensing channel should not run close to each other for long distances. for detailed information, refer to application note an2869. docid18315 rev 6 37/65 stm8t143 electrical characteristics 64 9 electrical characteristics 9.1 parameter conditions unless otherwise specified, all voltages are in reference to v ss . 9.1.1 minimum and maximum values unless otherwise specified, the minimum and maximum values are guaranteed in the worst conditions of ambient temperature and supply voltage by tests in production on 100% of the devices with an ambient temperature at t a = 25 c. data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. 9.1.2 typical values unless otherwise specified, typical data are based on t a = 25 c, and v dd = 5 v. they are given only as design guidelines and are not tested. 9.1.3 typical curves unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 9.1.4 loading capacitor the loading conditions used for pin parameter measurement are shown in figure 20 . figure 20. pin loading conditions output pin 50 pf electrical characteristics stm8t143 38/65 docid18315 rev 6 9.2 absolute maximum ratings stresses above those listed as ?absolute ma ximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device under these conditions is not implied. ex posure to maximum rating conditions for extended periods may affect device reliability. 9.3 operating conditions 9.3.1 general operating conditio ns and supply characteristics table 7. voltage characteristics symbol ratings maximum value unit v dd ? v ss supply voltage 6.8 (1) 1. care must be taken as option bit could be modified if this voltage is higher than 5.5 v. v table 8. current characteristics symbol ratings maximum value unit i vdd total current into v dd power lines (source) (1) 1. all power (v dd ) and ground (v ss ) lines must always be connect ed to the external supply. 2 ma i vss total current out of v ss ground lines (sink) (1) 2 i io output current sunk by output pin 1 output current sourced by output pin 1 table 9. thermal characteristics symbol ratings value unit t stg storage temperature range ? 65 to +150 c t j junction temperature range (so8 narrow and ufdfpn8 package) 90 c table 10. operating characteristics symbol parameter min. max. unit v dd supply voltage 2.3 5.5 v t a operating temperature -40 +85 c t vdd turn-on slope (rise time rate) 010 ms/v turn-off slope (fall time rate) 010 (1) 1. the supply voltage must reach 0 v when it drops below the minimum operating voltage. docid18315 rev 6 39/65 stm8t143 electrical characteristics 64 9.3.2 average current consumption test conditions: t a = 25 c, c x = 20 pf, and r x = 2 k note: consumption does not depend on detection thresholds. 9.3.3 i/o pin characteristics table 11. average current consumption symbol parameter conditions typ. max. unit i dd normal power mode (1) 1. tested in production. 3.05 v dd 5.5 60 75 a low power mode 1 (2) 2. not applicable for silicon revisi on 1, please refer to the stm8t143 errata sheet (stm8t143 device limitations). 30 - low power mode 2 (2) 17 - low power mode 3 (2) 11 - control halt mode (2) 27 normal power mode (1) v dd = 2.3 v 45 60 low power mode 1 (2) -- low power mode 2 (2) -- low power mode 3 (2) -- control halt mode (2) 27 table 12. out/tout/data streaming pin characteristics symbol parameter conditions min (1) 1. guaranteed by characterizati on, not tested in production. typ. max. (1) unit v oh v dd = 5 v i load = 1 ma t a = @ 25 c v dd -0.1 v dd -0.1 - v v dd = 3.3 v v dd -0.1 v dd -0.1 - v dd = 2.5 v v dd -0.2 v dd -0.1 - v dd = 2.3 v v dd -0.2 v dd -0.1 - v ol v dd = 5 v - 0.06 0.07 v dd = 3.3 v - 0.06 0.08 v dd = 2.5 v - 0.06 0.08 v dd = 2.3 v - 0.07 0.09 i lkg input leakage current (2) 2. the maximum value may be exceeded if negat ive current is injected on adjacent pins. -1 - 1 a electrical characteristics stm8t143 40/65 docid18315 rev 6 table 13. pout/tout pin characteristics symbol parameter conditions min (1) 1. guaranteed by characterizati on, not tested in production. typ. max. (1) unit v oh v dd = 5 v i load = 1 ma t a = @ 25 c v dd -0.1 v dd -0.1 - v v dd = 3.3 v v dd -0.1 v dd -0.1 - v dd = 2.5 v 3.4 2.4 - v dd = 2.3 v v dd -0.1 v dd -0.1 - v ol v dd = 5 v - 0.03 0.04 v dd = 3.3 v - 0.03 0.05 v dd = 2.5 v - 0.05 0.07 v dd = 2.3 v - 0.05 0.07 i lkg input leakage current (2) 2. the maximum value may be exceeded if negat ive current is injected on adjacent pins. --1-1a table 14. ctrl pin characteristics symbol parameter conditions min (1) 1. guaranteed by characteriza tion, not tested in production. max. (1) unit v il v dd = 5 v t a = @ 25 c -0.5 v v dd = 3.3 v - 0.3 v dd = 2.5 v - 0.25 v dd = 2.3 v - 0.2 v ih v dd = 5 v 4.5 - v dd = 3.3 v 3.0 - v dd = 2.5 v 2.25 - v dd = 2.3 v 1.8 - i lkg input leakage current (2) 2. the maximum value may be exceeded if negat ive current is injected on adjacent pins. --11a docid18315 rev 6 41/65 stm8t143 electrical characteristics 64 9.4 regulator and reference voltage table 15. regulator and reference voltage symbol parameter condition min. typ. max. unit c ref voltage regulator decoupling capacitance (1) -1-10f v reg regulated voltage during acquisition (2) 3.05 v dd 5.5 2.35 2.5 2.75 v 2.3 v dd 2.65 - v dd -0.15 - 1. equivalent serial r resistor 0.2 at 1 mhz. 2. operating above 3.05 v improves the device noise rejection. between 2.65 v and 3.05 v the regulated voltage evolves gradually between vdd - 0.15 v and the regulated voltage. electrical characteristics stm8t143 42/65 docid18315 rev 6 9.5 capacitive sensing characteristics the values in table 16: general capacitive sensing characteristics are guaranteed by design. they include the os cillator tolerance, the t sampling period, and the debouncing influence. . table 16. general capacitive sensing characteristics symbol parameter min typ max unit f transfer charge-transfer frequency 200 (1) 250 300 (1) khz t sampling (2) normal power mode 7 9 11 ms low power mode 1 21 27 33 low power mode 2 80 100 120 low power mode 3 240 300 360 t aet automatic electrode tuning process time (3) -59- t ctrl acquisition halt or reference freeze control 40 - - t recal_control ctrl pin pulse duration for recalibration 24 30 36 response time (4) normal power mode - 60 - low power mode 1 - 125 - low power mode 2 - 315 - low power mode 3 - 850 - t aet_halt aet halt period after end of detection - 3 - s r f th ecs filter freeze threshold in release state - ref 8 - burst count t f th ecs filter freeze threshold in touch state - ref +16 - aet target value aet target value 1344 1600 1856 gain gain target value a - 200 - gain target value b - 250 - gain target value c - 300 - gain target value d - 350 - gain target value e - 400 - gain target value f - 550 - gain target value g - 700 - gain target value h - 850 - docid18315 rev 6 43/65 stm8t143 electrical characteristics 64 t recal time after recalibration before optimal device sensitivity (see section 6: device operation ). note: this value depends on the signal variation including noise level -354- t sampling t su device startup time (5) -51- ddc detection debounce count (touch) - 2 - detection debounce count (proximity) - 6 - eddc end of detection debounce count (touch) - 2 - end of detection debounce count (proximity) - 3 - v cxl low state voltage value on c x during burst - 0.6 - v v trip acquisition reference voltage - 0.8 - 1. min and max values for f transfer are given for a 3 v to 5.5 v operating range. 2. if data streaming mode is activated, t sampling is increased by the data frame period. please refer to section 9.6: streaming mode characteristics . 3. t aet depends on the c x capacitance value. this typical va lue is given for an electrode of 18 pf 4. response time for detection depends on the event occurrence time during the acqu isition period, the threshold settings, and the signal strength. 5. the device startup time is the time af ter power-up before any possible actuation. table 16. general capacitive sensing characteristics (continued) symbol parameter min typ max unit table 17. internal c s value internal sampling capacitor selection bits (ics) c s capacitance value (nf) ics2 (1) 1. this bit is also used for ep cc selection. please refer to table 18: implemented epcc values (pf) . ics1 ics0 typ 000 1.5 001 2 010 3 011 5 100 4.5 101 6 110 11 111 17.5 electrical characteristics stm8t143 44/65 docid18315 rev 6 9.6 streaming mode characteristics figure 21. data streaming timing diagram table 18. implemented epcc values (pf) general name epcc name ics bit 2 01 implemented capacitance values epcc 0 0.3 0.6 epcc 1 0.6 1.2 epcc 2 1.2 2.4 epcc 3 2.4 4.8 epcc 4 4.8 9.6 epcc 5 9.6 19.2 maximum pcc capacitance value 18.9 37.8 table 19. external sensing component characteristics symbol parameter min. typ. max. unit c x equivalent electrode capacitance 1 - 60 pf c t equivalent touch capacitance - 5 - r x electrode serial resistance - 2 22 kohm table 20. data streaming timing characteristics symbol parameter typ. unit t start data low time 17 s t bit data bit time 17 t stop data high time 29 d l w % , 7 w 6 7 $ 5 7 w 6 7 2 3 ' $ 7 $ docid18315 rev 6 45/65 stm8t143 electrical characteristics 64 9.7 emc characteristics susceptibility and emission tests are perf ormed on a sample basis during product characterization. both the sample and its applicative hardware environment are mounted on a dedicated specific emc board defined in the iec61967-1 standard. 9.7.1 functional ems (elect romagnetic susceptibility) while running in the above described environment the product is stressed by two electromagnetic events until a failure occurs. ? esd : electrostatic discharge (positive and negati ve) is applied on all pins of the device until a functional disturbance occurs. this test complies with the iec 1000-4-2 standard. ? ftb : a burst of fast transient voltage (p ositive and negative) is applied to v dd and v ss through a 100 pf capacitor, until a function al disturbance occurs. this test complies with the iec 1000-4-4 standard. a device reset allows normal operations to be resumed. the test results are given in table 21 based on the ems levels and classes defined in application note an1709. 9.7.2 prequalification trials 9.7.3 electromagnetic interference (emi) emission tests conform to the iec61967-2 standard for board layout and pin loading. worse case emi measurements are performed during maximum device activity. table 21. ems data symbol parameter conditions level/class v eftb fast transient voltage burst limits to be applied through 100pf on v dd and v ss pins to induce a functional disturbance v dd = 5 v, t a = +25 c, ufdfpn8 package, complies with iec 1000-4-4 4a table 22. emi data symbol parameter general conditions monitored frequency band rc osc = 1 mhz (1) 1. data based on characterization results, not tested in production. unit s emi peak level v dd = 5 v, t a = +25 c, ufdfpn8 package, complies with sae j1752/3, no finger on touch electrode 0.1 mhz to 30 mhz -4 dbv 30 mhz to 130 mhz -3 130 mhz to 1 ghz -4 sae emi level - 1 electrical characteristics stm8t143 46/65 docid18315 rev 6 9.7.4 absolute maximum ratings (electrical sensitivity) based on two different tests (esd and lu) using specific measurement methods, the product is stressed in order to determine its performance in terms of electrical sensitivity. for more details, refer to the application note an1181. 9.7.5 electrostatic discharge (esd) electrostatic discharges (3 positive then 3 negative pulses separated by 1 second) are applied to the pins of each sample according to each pin combinati on. the sample size depends on the number of supply pins in the device (3 parts*(n+1) supply pin). this test conforms to the jesd22-a114a/a115a standard. for more details, refer to the application note an1181. m 9.7.6 static latchup two complementary static tests are required on 10 parts to assess the latchup performance. ? a supply overvoltage (applied to each power supply pin) and ? a current injection (applied to each input, output and configurable i/o pin) are performed on each sample. this test conforms to the eia/jesd 78 ic latchup standard. for mo re details, refer to application note an1181. table 23. esd absolute maximum ratings symbol ratings conditions class maximum value (1) 1. data based on characterization results, not tested in production unit v esd(hbm) electrostatic discharge voltage (human body model) t a = +25c, conforming to jesd22-a114 3a 4 kv v esd(cdm) electrostatic discharge voltage (charge device model) t a = +25c, conforming to jesd22-c101 iv 1 table 24. electrical sensitivities symbol parameter conditions class (1) 1. class description: a class is an stmi croelectronics internal specificatio n. all its limits are higher than the jedec specifications, that means when a device belongs to class a it exceeds the jedec standard. class b strictly covers all the jedec criteria (international standard). lu static latchup t a = +25 c a t a = +85 c docid18315 rev 6 47/65 stm8t143 package characteristics 64 10 package characteristics in order to meet environmental requirements, st offers these devices in different grades of ecopack? packages, depending on their le vel of environmental compliance. ecopack? specifications, grade definitions a nd product status are available at www.st.com . ecopack? is an st trademark. package characteristics stm8t143 48/65 docid18315 rev 6 10.1 package mechanical data 10.1.1 so8 package mechanical data figure 22. so8-lead plastic small outline - package outline table 25. so8-lead plastic small outline - package mechanical data symbol millimeters inches (1) 1. values in inches are rounded to 4 decimal digits min typ max min typ max a - - 1.750 - - 0.0689 a1 0.100 - 0.250 0.0039 - 0.0098 a2 1.250 - - 0.0492 - - b 0.280 - 0.480 0.0110 - 0.0189 c 0.170 - 0.230 0.0067 - 0.0091 ccc - - 0.100 - - 0.0039 d (2) 2. dimension d does not include mold flas h, protrusions or gate burrs. mold flash, protrusions or gate burrs should not exceed 0.15mm in total (both side). 4.800 4.900 5.000 0.1890 0.1929 0.1969 e 5.800 6.000 6.200 0.2283 0.2362 0.2441 e1 (3) 3. dimension e1 does not include interlead flash or pr otrusions. interlead flash or protrusions should not exceed 0.25 mm per side. 3.800 3.900 4.000 0.1496 0.1535 0.1575 e - 1.270 - - 0.0500 - h 0.250 - 0.500 0.0098 - 0.0197 k 0 - 8 0 - 8 l 0.400 - 1.270 0.0157 - 0.0500 l1 - 1.040 - - 0.0409 - so-a e1 8 ccc b e a d c 1 e h x 45? a2 k 0.25 mm l l1 a1 gauge plane docid18315 rev 6 49/65 stm8t143 package characteristics 64 figure 23. so8 narrow recommended footprint (dimensions in mm) 1. drawing is not to scale. h ( ( 0 6 9 package characteristics stm8t143 50/65 docid18315 rev 6 10.1.2 ufdfpn8 package mechanical data figure 24. ufdfpn8-lead ultra thin fine pitch dual flat package (mlp) package outline table 26. ufdfpn8-lead ultra thin fine pi tch dual flat - package mechanical data symbol millimeters inches (1) 1. values in inches are rounded to 4 decimal digits min typ max min typ max a (2) 2. in order to prevent undesired effects such as spuri ous detections or modifi ed sensitivity the ufdfpn8 package should not be directly exposed to li ght sources (visible or invisible). 0.450 0.550 0.600 0.0177 0.0217 0.0236 a1 0.000 0.020 0.050 0.0000 0.0008 0.0020 b 0.200 0.250 0.300 0.0079 0.0098 0.0118 d 1.900 2.000 2.100 0.0748 0.0787 0.0827 d2 1.500 1.600 1.700 0.0591 0.0630 0.0669 e 2.900 3.000 3.100 0.1142 0.1181 0.1220 e2 0.100 0.200 0.300 0.0039 0.0079 0.0118 e - 0.500 - - 0.0197 - l 0.400 0.450 0.500 0.0157 0.0177 0.0197 l1 - - 0.150 - - 0.0059 l3 0.300 - - 0.0118 - - tolerance millimeters inches ddd (3) 3. applied for exposed die paddle and terminals. exclude embedding part of exposed die paddle from measuring. - 0.080 - - 0.0031 - d e ufdfpn-01 a a1 ddd l1 e b d2 l e2 l3 docid18315 rev 6 51/65 stm8t143 package characteristics 64 figure 25. ufdfpn 2 x 3 mm recommended footprint (dimensions in mm) 1. drawing is not to scale. 0 6 9 package characteristics stm8t143 52/65 docid18315 rev 6 10.2 package therma l characteristics the maximum chip junction temperature (t jmax ) must never exceed the values given in table 10: operating characteristics on page 38 . the maximum chip-junction temperature, t jmax , in degrees celsius, may be calculated using the following equation: t jmax = t amax + (p dmax x ja ) where: ? t amax is the maximum ambient temperature in c ? ja is the package junction-to-ambient thermal resistance in c/w ? p dmax is the sum of p intmax and p i/omax (p dmax = p intmax + p i/omax ) ? p intmax is the product of i dd and v dd , expressed in watts. this is the maximum chip internal power. ? p i/omax represents the maximum power dissipation on output pins where: p i/omax = (v ol *i ol ) + ((v dd -v oh) *i oh ), taking into account the actual v ol /i ol and v oh /i oh of the i/os at low and high level in the application. note: thermal resistances are based on jedec jesd51-2 with 4-layer pcb in a natural convection environment. 10.2.1 reference document jesd51-2 integrated circuits thermal test method environment conditions - natural convection (still air). available from www.jedec.org. table 27. thermal characteristics symbol parameter value unit ja thermal resistance junction-ambient so8 (narrow) 130 c/w ja thermal resistance junction-ambient ufdfpn 8 (2 x 3 mm) 120 c/w docid18315 rev 6 53/65 stm8t143 ordering information 64 11 ordering information 11.1 stm8t143 ordering information scheme figure 26. stm8t143 ordering information scheme 1. see explanation below of ?in factor y option byte programming service? 2. the stm8t143 otp devices are available for devel opment and production. these parts are blank devices with unconfigured option bytes (all option bits are set to ?0?). stm8t 143 a u xxxy tr device type stm8t: st touch sensing mcu package m: so8 (narrow outline) u: ufdfpn8 (dual flat no lead) example: pin count a: 8 pins device sub-family 143 = 1 proximity detection channel device configuration xxxy: device with spec ific configuration (1) 61t: revision 1/otp blank device (all user bits set to 0) (2) 62t: revision 2/otp blank device (all user bits set to 0) (2) packing no character: tray or tube tr: tape and reel ordering information stm8t143 54/65 docid18315 rev 6 11.2 orderable favorite device lists the stm8t143 otp devices listed below are available for development and production. these parts are blank devices or config ured with a specific configuration. see table 28 . contact stmicroelectronics sa les office for availability. 11.2.1 part number option bytes 11.3 in-factory option by te programming service for specific configurations, in-factory option byte programming is available on customer request and for large order quant ities. customers have to fill ou t the option list (see below) and send it back to stmicroelectroni cs. customers are then informed by stmicroelectronics about the ordering pa rt number corresponding to the customer configuration. the xxxy digits of the final ordering part number (e.g. stm8t143auxxxy) depends on the device configuration and firmware revision number and is assigned by stmicroelectronics. table 28. option byte values part number opt0 opt1 opt2 stm8t143am61t 0x00 0x00 0x00 stm8t143am62t 0x00 0x00 0x00 stm8t143autab2tr 0xc8 0x00 0x10 stm8t143aumei2tr 0xf0 0x00 0x00 stm8t143aulet2tr 0xe0 0x01 0x10 docid18315 rev 6 55/65 stm8t143 ordering information 64 11.4 revision code on device markings table 29 , figure 27 and figure 28 show the part numbers and standard marking composition for the ufdfpn8 and so8 packages respectively. figure 27. so8 package marking table 29. device identification rev no. part no. so8 package part no. ufdfpn8 package marking so8 package (1) 1. see figure 27: so8 package marking . marking ufdfpn8 package (2) 2. see figure 28: ufdfpn8 package marking . 1 stm8t143am61t stm8t143au61t 8t143a61 t143 2 stm8t143am62t stm8t143au62t t143am62 1432 3 n/a stm8t143autab2tr n/a tab 4 n/a stm8t143aumei2tr n/a mei 5 n/a stm8t143aulet2tr n/a let 3 $ & . $ * ( 7 2 3 6 , ' ( 0 6 9 3 l q l g h q w l i l f d w l r q f r u q h u 0 d u n l q j d u h d 6 7 o r j r ' d w d f r g h ordering information stm8t143 56/65 docid18315 rev 6 figure 28. ufdfpn8 package marking 3 $ & . $ * ( 7 2 3 6 , ' ( d l e 1 j o j e f o u j g j d b u j p o b s f b 0 d u n l q j d u h d ' d w h f r g h docid18315 rev 6 57/65 stm8t143 ordering information 64 stm8t143 programming service option list rev 6 (last update: october 2013) customer name: address: contact name: phone number customer settings (tick one box by option) package type: dfn8: stm8t143au so8: stm8t143am(1) output type (used only in ctrl mode ? see section 6.2.2: control mode ) proximity output (2) touch output release threshold ratio (see section 5.3: detection and release thresholds ) 75 % (2) 87.5 % gain target gain target value a (200) (2) gain target value b (250) gain target value c (300) gain target value d (350) gain target value e (400) gain target value f (550) gain target value g (700) gain target value h (850) data streaming mode (see section 6.2.3: data streaming mode ) disabled (2) enabled low power mode (see section 6.4: power modes and table 16: general capacitive sensing characteristics ) normal power mode (2) low power mode 1 low power mode 2 low power mode 3 reference freeze timeout t rft (see section 5.5.3: reference freeze and reference freeze timeout ) infinite (2) 18 s 60 s 3s dynamic calibration delay t dycal (see section 5.4: dynamic calibration (dycal) ) 250 ms (2) 1s ordering information stm8t143 58/65 docid18315 rev 6 dual/control mode (see section 6.2.1: dual output mode and section 6.2.2: control mode ) pin 8 in control input (2) pin 8 in proximity output mode touch detection threshold (see section 5.3: detection and release thresholds ) touch detection (tth) threshold value 40 (2) touch detection (tth) threshold value 60 touch detection (tth) threshold value 100 touch detection (tth) threshold value 200 touch detection (tth) threshold value 340 touch detection (tth) threshold value 500 touch detection (tth) threshold value 700 touch detection (tth) threshold value 900 proximity detection threshold (see section 5.3: detection and release thresholds ) proximity detection (pth) threshold value 4 (2) proximity detection (pth) threshold value 8 proximity detection (pth) threshold value 16 proximity detection (pth) threshold value 32 output polarity (see section 6.3: output polarity ) (3) active low (2) active high control type (see section 6.2.2: control mode ) halts conversion control (2) reference freeze control packaging tape and reel tray or tube (1) fastrom is not available in so8 device. (2) configuration by default in otp devices. (3) effective only when data streaming mode is disabled comment: date: signature: stm8t143 programming service option list rev 6 (last update: october 2013) customer name: address: contact name: phone number customer settings (tick one box by option) docid18315 rev 6 59/65 stm8t143 stm8t143 programming tool 64 12 stm8t143 programming tool figure 29 shows the stm8t143 programming tool. to program the device option bytes the following materials are available: ? programming socket board (stm8t14x-sb). when connected to the programming dongle, this board allows the programming of so8 or ufdfpn8 devices. ? a programming dongle (st-tslink) and its associated programming software, stvp. figure 29. stm8t143 programming tool programming socket board (stm8t14x-sb) programming dongle (st-tslink) table 30. ordering information part number order codes description st-tslink st-tslink stm8t143 programming dongle stm8t14x-sb stm8t14x-sb stm8t143 socket board revision history stm8t143 60/65 docid18315 rev 6 13 revision history table 31. document revision history date revision changes 17-may-2011 1 initial release 31-aug-2011 2 features : updated bullet about low power management. block diagram : updated figure 1: stm8t143 block diagram , removed power-on-reset (por) , and updated advanced proxsense engine . section 4.3: internal sampling capacitor : added ? to fit a wide range of applications ?. section 5: stm8t143 processing : realigned bullet points according to order of subsections. section 5.2: signal calculati on and reference calibration : updated section 5.3: detection and release thresholds : updated figure 7: automatic electrode tuning (aet) : replaced figure 8: signal reference and detection threshold (not detailed) : replaced. figure 9: dycal general operation : replaced figure 10: dycal operation with water residue : replaced figure 11: no dycal : updated added figure 12: iir filter formula section 5.5.2: ecs halt : in figure 14: unwanted detection managed by the reference freeze timeout : replaced ?reference - d th ? with ?reference - pth?; added note 5.5.4 . section 5.4: dynamic calibration (dycal) : updated added section 5.5.4: ecs filter constant adjustment and figure 15: ecs filter k constant management . removed reference freeze timeout figure section 5.7: host control input : updated table 3: option byte description : updated opt2 (bit 4), opt0 (bits [7:5] and [4:3]). table 6: data streaming frame : updated description of bit 47 (byte 5). table 8: current characteristics : updated i vdd , i vss , and i io max values. table 11: average current consumption : updated all typ and max values; updated footnotes. table 12: out/tout/data streaming pin characteristics : replaced all tbds with values; added c ondition 25 c; added footnote 1. table 13: pout/tout pin characteristics : replaced all tbds with values; added condition 25 c; added footnote 1. table 14: ctrl pin characteristics : replaced all tbds with values; added condition 25 c; added footnote 1. docid18315 rev 6 61/65 stm8t143 revision history 64 31-aug-2011 2 cont?d table 16: general capacitive sensing characteristics : updated f transfer , response time, and device startup time parameters; added min and max values for t sampling ,and aet target value parameter; added footnotes 1. and 5. ; updated footnote 4. table 17: internal cs value : added ics bit values. table 18: implemented epcc values (pf) : added epcc6 and capacitance bit 6 values. table 21: ems data : removed v fesd parameter and added level/class for v eftb parameter. table 22: emi data : added values for rc osc = 1 mhz. table 23: esd absolute maximum ratings : updated class, max value and unit. table 24: electrical sensitivities : added class value. table 26: ufdfpn8-lead ultra thin fine pitch dual flat - package mechanical data : added footnote 2. updated programming service option list. 15-nov-2011 3 added so8 package and updated all information relating to this package throughout document. figure 3: ufdfpn8 pinout : updated pins 1 and 8. table 1: stm8t143 pin descriptions : updated layout and content. figure 5: stm8t143 measuring circuitry : changed ?stm8t143? to ?device?. section 4.4: electrode parasitic capacitance compensation (epcc) : removed text concerning epcc hardware and fixed compensation capacitance. section 5: stm8t143 processing : updated title; updated second bullet point to ?signal and reference calibration?. section 5.1: automatic electrode tuning (aet) : text updated to improve technical clarity and readability, values replaced; updated and improved appearance of figure 7: automatic electrode tuning (aet) . section 5.2: signal calculati on and reference calibration : removed bullet points regarding aet; small text changes. section 5.3: detection and release thresholds : small text changes, corrections and clarifications; updated title, improved appearance, and removed ?t dycal ? from figure 8: signal reference and detection threshold (not detailed) . section 5.4: dynamic calibration (dycal) : small text changes and corrections; updated titles and content of figure 9: dycal general operation and figure 10: dycal operation with water residue ; improved appearance of all figures in this section. section 5.5.2: ecs halt : updated appearance of figure 13: ecs halt and removed note 2 underneath it. section 5.5.3: reference freeze and reference freeze timeout : moved section to current location; updated title and improved appearance of figure 14: unwanted detection managed by the reference freeze timeout . table 31. document revision history (continued) date revision changes revision history stm8t143 62/65 docid18315 rev 6 15-nov-2011 3 cont?d section 5.5.4: ecs filter constant adjustment : updated title and added reference to figure 15: ecs filter k constant management . section 5.6: debounce filter : removed last sentenc e of this section which concerned the halt function. section 5.7: host control input and section 5.7.1: ctrl pin management : removed. section 6: devi ce operation : updated bullet points concerning control, dual output, and data streaming modes. table 2: option bytes : updated abbreviations for touch and proximity detection thresholds. table 3: option byte description : small corrections to bit 5 (opt2), bit 0 (opt 1) and bit 0 (opt 0); added gain target values (instead of a, b, c etc.) for bits [3:1] of opt 2. section 6.2.1: dual output mode : renamed section; added table 4: pin 1 configuration and table 5: pin 8 configuration . section 6.2.2: control mode : small text changes and corrections; added final explanatory sentence to reference freeze control mode . section 6.2.3: data streaming mode : small text changes and corrections; updated bits 34, 47, 46, and 45 of table 6: data streaming frame . section 6.4: power modes : moved to the end of section 6 . section 7: typical application diagram : moved after section 6: device operation . figure 17: typical application schematic for control mode : renamed figured and updated content and footnotes. figure 18: typical application schematic for dual output mode : renamed figured and updated content and footnotes. figure 19: typical application sc hematic for data streaming mode : renamed figured and updated content and footnotes. table 7: voltage characteristics : updated max value of supply voltage parameter and added footnote 1. table 11: average current consumption : updated with new typ and max values; updated first condit ion; replaced ?conversion? with ?control?; updated footnote 2. table 12: out/tout/data streaming pin characteristics : removed footnote 1. from ?typ? column. table 13: pout/tout pin characteristics : added ?tout? to table title; removed footnote 1. from ?typ? column. table 15: regulator and reference voltage : updated first condition. section 9.5: capacitive sensing characteristics : removed ?test conditions: t a = 25 c?; placed note at the end of this table at the beginning. table 16: general capacitive sensing characteristics : added typ value for parameter ?ctrl pin pulse duration for recalibration?; added typ values for parameters ?low power modes 1, 2, and 3? and removed footnote associated with them; replaced ?release? with ?touch? in the parameter ?ecs filter freeze threshold in touch state?; small corrections to footnotes 3. and 4. table 17: internal cs value : added typ value to ?c s capacitance value (nf) parameter; added footnote 1. table 31. document revision history (continued) date revision changes docid18315 rev 6 63/65 stm8t143 revision history 64 15-nov-2011 3 cont?d table 18: implemented epcc values (pf) : updated title; replaced name of bit; removed epcc 6 data, updated ?maximum pcc capacitance value?; added footnote 1. figure 23: so8 narrow recommended footprint (dimensions in mm) : added. figure 25: ufdfpn 2 x 3 mm recommended footprint (dimensions in mm) : added. figure 26: stm8t143 ordering information scheme : updated package and device configuration information; updated footnote 2. section 11.2: orderable favorite device lists : updated rev 1 ufdfpn8 otp device and added rev 2 ufdfpn8 otp device. figure 27: so8 package marking : added. figure 28: ufdfpn8 package marking : added. updated programming service option list. section 12: stm8t143 programming tool : updated first bullet point and replaced figure 29: stm8t143 programming tool . 12-sep-2012 4 updated all information relating to control mode. figure 2: so8 pinout , figure 3: ufdfpn8 pinout and table 1: stm8t143 pin descriptions :updated pin 1 name to ?out?. table 10: operating characteristics : updated min. value of v dd . table 11: average current consumption : updated v dd conditions. table 12: out/tout/data streaming pin characteristics and table 13: pout/tout pin characteristics : updated min. and typ. values of v oh . updated list of v dd parameter. added i lkg parameter. table 14: ctrl pin characteristics : updated list of v dd parameter. added i lkg parameter. table 15: regulator and reference voltage : added note 2. updated v reg conditions, min. and max. values. table 16: general capacitive sensing characteristics : updated min. and max. values. added v trip parameter. table 18: implemented epcc values (pf) : moved note 1. on ics bit 2 definition. updated programming service option list. section 12: stm8t143 programming tool : updated part number of programming socket board. table 31. document revision history (continued) date revision changes revision history stm8t143 64/65 docid18315 rev 6 17-apr-2013 5 updated table 7: voltage characteristics . replaced any occurrence of t dycal_t by t dycal . in table 2: option bytes , replaced: ? "tdycal" by "dynamic calibration delay" ? "touch detection threshold (tth)" by "touch detection threshold? ? ?proximity detection threshold (pth)? by ?proximity detection threshold?. in table 3: option byte description ? replaced the release threshold ratio of 90% by 87.5%. ? renamed ?reference freeze timeout" by "reference freeze timeout (trft) " ? updated the value information for the reference freeze timeout ? renamed "tdycal" by "dynamic calibration delay (tdycal)" ? updated the value information for the dynamic calibration delay removed trft and tdycal rows in table 16: general capacitive sensing characteristics updated the ?programming service option list? form in section 11.4: revision code on device markings changed ?touch output? signal rising edge position in figure 9: dycal general operation and figure 10: dycal operation with water residue 18-oct-2013 6 modified note 2 below table 15: regulator and reference voltage on page 41 . removed note 1 in table 18: implemented epcc values (pf) on page 44 . updated section 11.2: orderable favorite device lists on page 54 added section 11.4: revision code on device markings on page 55 . moved section 11.4: revision code on device markings on page 55 to section 11.2.1: part number option bytes on page 54 added last two rows in table 29: device identification on page 55 . updated the ?programming service option list? form in section 11.4: revision code on device markings on page 55 . added first row in section : customer settings (tick one box by option) on page 57 and insert note. added note in section : proximity output(2) on page 57 updated disclaimer content to rev5-4 updated section : (1) fastrom is not available in so8 device. on page 58 added new code fastrom in table 28: option byte values on page 54 and table 29: device identification on page 55 table 31. document revision history (continued) date revision changes docid18315 rev 6 65/65 stm8t143 65 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wi th product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? 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